Lanthanum Manganate (LaMnO3) Sputtering Targets
Product Specifications
| Property | Value |
|---|---|
| Product | Lanthanum Manganate (LaMnO₃) Sputtering Target |
| Purity | 99.9% |
| Size | 4” |
| Thickness | 0.125” |
Overview
Sputtering is a reliable and widely used technique for depositing thin films onto a variety of substrate shapes and sizes. The process is repeatable, scalable, and adaptable for research, development, and production environments involving medium to large substrate areas. Depending on the process parameters, chemical reactions may occur on the target surface, during particle transport, or directly on the substrate. While sputter deposition involves many variables, these parameters give experts precise control over film growth and microstructure.
Applications
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Thin-Film Deposition: Material is eroded from the “target” and deposited onto substrates such as silicon wafers.
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Semiconductor Etching: Sputter etching is used where high anisotropy is required, regardless of selectivity.
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Material Analysis: Techniques such as secondary ion mass spectrometry (SIMS) rely on sputtering to determine composition and detect trace impurities.
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Space Science: Sputtering contributes to space weathering, altering the physical and chemical properties of airless celestial bodies, including asteroids and the Moon.
