Magnesium (Mg) Sputtering Targets
Purity: 99.98%, Size: 3”, Thickness: 0.250”
Sputtering is a proven technique capable of depositing thin films from a wide range of materials onto substrates of diverse shapes and sizes.
The process using sputter targets is repeatable and can be scaled from small research and development projects to production batches involving medium to large substrate areas. Chemical reactions may occur on the target surface, in flight, or on the substrate depending on the process parameters. Although the many parameters make sputter deposition a complex process, they also allow experts a high degree of control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. The deposition achieved with sputter targets is a method of forming thin films by sputtering, which involves eroding material from a “target” source and transferring it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching. Sputter etching is selected in cases where a high degree of anisotropic etching is required and selectivity is not a major concern.
Sputter targets are also used for analysis by gradually etching away the target material. One example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As sputtering progresses, the concentration and identity of the emitted atoms are measured using mass spectrometry. Through the aid of the sputtering target, the composition of the target material can be determined, and even extremely low impurity concentrations can be detected.
Sputtering targets also have applications in space. Sputtering is one form of space weathering, a process that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
