Iron Oxide (Fe₃O₄) Sputtering Target
Specifications:
| Property |
Value |
| Purity |
99.9% |
| Size |
2” |
| Thickness |
0.125” |
Description:
Sputtering is a proven technology for depositing thin films from various materials onto different substrates. Fe₃O₄ sputtering targets provide repeatable performance and can scale from research to production. Reactions can occur on the target surface, in-flight, or on the substrate depending on process parameters, allowing precise control over film growth and microstructure.
Applications:
| Application Area |
Description |
| Film Deposition |
Deposits thin films by eroding material from a target onto substrates such as silicon wafers. |
| Semiconductor Etching |
Provides high etching anisotropy when selectivity is not critical. |
| Analytical Techniques (SIMS) |
Enables composition analysis and trace impurity detection by sputtering at a constant rate and using mass spectrometry. |
| Space Applications |
Used in studies of space weathering, which changes the physical and chemical properties of airless bodies like asteroids and the Moon. |
For larger inquiries, please contact us.
Download ……………………….. MSDS
