| Category | Details |
|---|---|
| Product Name | Praseodymium Calcium Manganate (Pr₀.₇Ca₀.₃MnO₃) Sputtering Targets |
| Purity | 99.9% |
| Size | 1” |
| Thickness | 0.250” |
| Description | Sputtering is a proven technology for depositing thin films from a variety of materials onto diverse substrates. The process is repeatable, scalable, and allows precise control over film growth and microstructure. |
Applications
| Application Area | Details |
|---|---|
| Thin Film Deposition | Deposits thin films by eroding material from the target onto substrates such as silicon wafers. |
| Semiconductor Etching | Used in sputter etching when high anisotropy is required and selectivity is not a concern. |
| Material Analysis (SIMS) | Target is sputtered at a constant rate; mass spectrometry measures atom concentration and identity, detecting even trace impurities. |
| Space / Space Weathering | Studies physical and chemical changes on airless bodies such as asteroids and the Moon. |
