| Category | Details |
|---|---|
| Product Name | Lanthanum Titanate (LaTiO3) Sputtering Targets |
| Purity | 99.9% |
| Size | 6” |
| Thickness | 0.125” |
| Description | Sputtering is a proven technology for depositing thin films from various materials onto diverse substrates. The process is repeatable, scalable, and allows precise control over film growth and microstructure. |
Applications
| Application | Details |
|---|---|
| Thin Film Deposition | Material is eroded from the target onto substrates such as silicon wafers to form thin films. |
| Semiconductor Etching | Used for sputter etching where high etching anisotropy is required and selectivity is not a concern. |
| Material Analysis (SIMS) | Target is sputtered at a constant rate; mass spectrometry measures atom concentration and identity, enabling detection of trace impurities. |
| Space / Space Weathering | Helps study physical and chemical changes on airless bodies, such as asteroids and the Moon. |
