Lanthanum Manganate (LaMnO₃) Sputtering Targets
Product Specifications
| Property | Value |
|---|---|
| Product | Lanthanum Manganate (LaMnO₃) Sputtering Target |
| Purity | 99.9% |
| Size | 3” |
| Thickness | 0.250” |
Overview
Sputtering is a reliable and widely used method for depositing thin films across a range of substrate types and geometries. The process is repeatable, scalable, and suitable for both research applications and medium-to-large production batches. Depending on the process conditions, chemical reactions may occur on the target surface, during particle transport, or at the substrate. Although sputtering involves many parameters, these variables provide experts with precise control over film growth and microstructure.
Applications
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Thin-Film Deposition: Material is eroded from a “target” and deposited onto substrates such as silicon wafers.
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Semiconductor Etching: Used where high anisotropy is required, even when selectivity is not a priority.
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Material Analysis: Essential in techniques like secondary ion mass spectrometry (SIMS), where sputtering enables detection of composition and trace impurities.
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Space Science: Sputtering contributes to space weathering, altering the physical and chemical characteristics of airless bodies including asteroids and the Moon.
