Lanthanum Manganate (LaMnO₃) Sputtering Targets
| Property | Specification |
|---|---|
| Purity | 99.9% |
| Size | 2” |
| Thickness | 0.125” |
Sputtering is a well-established technology for depositing thin films from a wide variety of materials onto diverse substrate shapes and sizes. The process using sputter targets is repeatable and scalable, suitable for both small research projects and larger production batches. Depending on process parameters, chemical reactions can occur on the target surface, in-flight, or on the substrate. While sputter deposition involves many parameters, it offers precise control over film growth and microstructure.
Applications
Sputtering targets are primarily used for thin film deposition, where material is eroded from a “target” source onto a “substrate,” such as a silicon wafer.
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Semiconductor fabrication: Sputtering targets are used for etching, particularly when high etching anisotropy is required and selectivity is less critical.
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Material analysis: Targets can be sputtered for analysis, such as in secondary ion mass spectrometry (SIMS), where the concentration and identity of sputtered atoms are measured to detect impurities.
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Space applications: Sputtering contributes to space weathering, altering the physical and chemical properties of airless bodies like asteroids and the Moon.
