Cobalt (Co) Sputtering Target — Specifications
| Property | Details |
|---|---|
| Material | Cobalt (Co) with Indium |
| Purity | 99.95% |
| Size | 3” |
| Thickness | 0.125” |
| Description | Sputtering technology for thin-film deposition on diverse substrates. Repeatable and scalable process. Chemical reactions may occur on the target, in-flight, or on the substrate. |
Applications of Sputtering Targets
| Application Area | Explanation |
|---|---|
| Film Deposition | Deposits thin films onto substrates such as silicon wafers by eroding target material. |
| Semiconductor Etching | Provides high etching anisotropy where selectivity is not a primary concern. |
| Analytical Techniques (SIMS) | Enables composition analysis and detection of trace impurities using mass spectrometry. |
| Space Science | Contributes to space weathering, altering physical and chemical properties of airless bodies like asteroids and the Moon. |
Cobalt-Specific Applications
| Property / Requirement | Explanation |
|---|---|
| Alloy Formation | Cobalt forms stable alloys with other metals; temperature stability allows use in turbine blades and jet engines. |
| Corrosion & Wear Resistance | Suitable for high-strength, wear-resistant applications, including industrial machinery and aerospace components. |
| Magnetic Properties | One of three room-temperature ferromagnets with uniaxial symmetry; widely used in magnetic recording and digital data storage. |
| Microelectronics | Sputtering targets used for thin films in microprocessors, DRAMs, and other semiconductor devices. |
| Dental & Biocompatibility | Cobalt alloys used in dental prosthetics to avoid nickel allergies. |
| DC Magnetron Sputtering | Efficiency relies on magnetic fields directing electrons back to the negatively charged target for deposition. |
