| Category | Details |
|---|---|
| Product Name | Praseodymium (Pr) Sputtering Targets |
| Purity | 99.9% |
| Size | 4” |
| Thickness | 0.125” |
| Description | Sputtering deposits thin films from various materials onto diverse substrate shapes. The process is repeatable, scalable, and allows precise control over growth and microstructure. |
Applications
| Application | Details |
|---|---|
| Thin Film Deposition | Erodes material from the target onto substrates such as silicon wafers to form thin films. |
| Semiconductor Etching | Used in sputter etching for high anisotropy processes where selectivity is not critical. |
| Material Analysis (SIMS) | Target is sputtered at a constant rate; mass spectrometry measures atom concentration and identity, detecting trace impurities. |
| Space / Space Weathering | Studies changes in physical and chemical properties of airless bodies such as asteroids and the Moon. |
