Zinc (Zn) Sputtering Targets
Purity: 99.99%, Size: 2”, Thickness: 0.125”
Sputtering is a proven technology capable of depositing thin films from a wide range of materials onto substrates of various shapes and sizes.
The process using sputter targets is repeatable and can be scaled from small research and development projects to production batches involving medium to large substrate areas. Depending on process parameters, chemical reactions may occur on the target surface, in-flight, or on the substrate. Although sputter deposition involves many variables, this complexity provides experts with extensive control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. The deposition achieved with sputter targets is a method of forming thin films by sputtering, which involves eroding material from a “target” and depositing it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching. Sputter etching is selected when a high degree of anisotropy is required and selectivity is not a primary concern.
Sputter targets are also used for analytical purposes by etching away target material.
One example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As sputtering progresses, the concentration and identity of the sputtered atoms are measured using mass spectrometry. With the help of the sputtering target, the composition of the material can be determined, and even extremely low impurity concentrations can be detected.
Sputtering targets also have applications in space. Sputtering is one of the processes involved in space weathering, which alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
