Zinc (Zn) Sputtering Targets
Purity: 99.95%, Size: 1”, Thickness: 0.250”
Sputtering is a proven technology used to deposit thin films from a wide range of materials onto substrates of various shapes and sizes.
The process using sputter targets is repeatable and can be scaled from small research and development projects to production batches involving medium to large substrate areas. Depending on process parameters, chemical reactions may occur on the target surface, in-flight, or on the substrate. Although sputter deposition involves many variables, this complexity enables experts to achieve a high degree of control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. The deposition created by sputter targets is a thin-film formation method involving the erosion of material from a “target” source onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching. Sputter etching is selected when a high degree of anisotropy is required and selectivity is not a critical concern.
Sputter targets are also used for analytical applications by etching away target material.
One example is secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As sputtering occurs, the concentration and identity of sputtered atoms are measured using mass spectrometry. With the aid of the sputtering target, the material’s composition can be determined, allowing detection of even extremely low impurity levels.
Sputtering targets also have applications in space. Sputtering is one of the mechanisms involved in space weathering, a process that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
