Tungsten Oxide (WO3) Sputtering Targets
Purity: 99.9%, Size: 2”, Thickness: 0.125”
Sputtering is a proven technology used to deposit thin films from a wide variety of materials onto substrates of diverse shapes and sizes.
The process using sputter targets is repeatable and can be scaled from small research and development projects to larger production batches.
The process with sputter targets can also be adapted for medium to large substrate areas. Chemical reactions may occur on the target surface, in-flight, or on the substrate depending on the process parameters. While these numerous parameters make sputter deposition a complex process, they provide experts with significant control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. Thin-film deposition by sputtering involves eroding material from a “target” source and transferring it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching. Sputter etching is chosen when a high degree of etching anisotropy is required and selectivity is not a primary concern.
Sputter targets are also used for analytical applications by gradually etching away the target material.
One example is secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. With the assistance of the sputtering target, the composition of the material can be determined, and even extremely low concentrations of impurities can be detected.
Sputtering targets also have applications in space. Sputtering is one of the processes involved in space weathering, which alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
