Tungsten Disulfide (WS2) Sputtering Targets
Purity: 99.9%, Size: 6”, Thickness: 0.250”
Sputtering is a well-established technology used to deposit thin films from a wide variety of materials onto substrates of different shapes and sizes.
The sputtering process is repeatable and can be scaled from small research and development projects to production batches involving medium to large substrate areas. Chemical reactions may occur on the target surface, in-flight, or on the substrate depending on the selected process parameters. Although sputter deposition involves many variables, this complexity allows experts to maintain a high degree of control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for film deposition. Thin films are produced by sputtering, a method in which material is eroded from a “target” and deposited onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching when a high degree of etching anisotropy is required and selectivity is not critical.
Sputtering targets are also used for analytical applications by gradually removing the target material.
An example of this is secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As sputtering proceeds, the concentration and identity of ejected atoms are measured using mass spectrometry. With the assistance of the sputtering target, the composition of the material can be identified, and even extremely low impurity levels can be detected.
Sputtering targets also have applications in space. Sputtering is a form of space weathering that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
