Titanium Nitride (TiN) Sputtering Targets, Indium
Purity: 99.5%, Size: 2”, Thickness: 0.125”
Sputtering is a proven technique capable of depositing thin films from a wide variety of materials onto substrates of diverse shapes and sizes.
The process involving sputter targets is repeatable and can be scaled from small research and development projects to larger production requirements.
The process with sputter targets can also be adapted for production batches involving medium to large substrate areas. Depending on the process parameters,
chemical reactions may occur on the target surface, in-flight, or directly on the substrate. Although sputter deposition involves many variables,
this complexity allows experts a high degree of control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for film deposition. Deposition using sputter targets is a method of creating thin films by sputtering,
which erodes material from a “target” source onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are also used to etch the target. Sputter etching is selected when a high degree of etching anisotropy
is required and selectivity is not a primary concern.
Sputter targets are additionally used for analytical purposes by removing surface material through etching.
One example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered,
the concentration and identity of the sputtered atoms are measured using mass spectrometry. With the assistance of the sputtering target,
the composition of the target material can be determined, and even extremely low concentrations of impurities can be detected.
Sputtering targets also have applications in space. Sputtering is one of the processes involved in space weathering, which alters the physical
and chemical properties of airless bodies such as asteroids and the Moon.
