Titanium Dioxide (TiO₂) Sputtering Targets
Purity: 99.99%, Size: 6”, Thickness: 0.250”, Beige to White
Sputtering is a proven method for depositing thin films from a wide range of materials onto various substrate shapes and sizes.
The process using sputter targets is repeatable and can be scaled from small research and development projects to larger production batches involving medium to large substrate areas. Depending on the process parameters, chemical reactions may take place on the target surface, in-flight, or on the substrate. Although sputter deposition involves many parameters and is a complex technique, it provides experts with extensive control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. This method creates thin films by sputtering, a process in which material is removed from a “target” source and deposited onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching. Sputter etching is selected when a high level of etching anisotropy is required and selectivity is not critical.
Sputter targets are also used for analytical applications by removing material from the target surface.
One example is secondary ion spectroscopy (SIMS), where the sample is sputtered at a constant rate. As sputtering continues, the concentration and identity of the sputtered atoms are measured using mass spectrometry. With the help of a sputtering target, the material composition can be identified, and extremely low impurity levels can be detected.
Sputtering targets also have applications in space science. Sputtering is one of the processes involved in space weathering, which alters the physical and chemical characteristics of airless bodies such as asteroids and the Moon.
