Titanium Dioxide (TiO₂) Sputtering Targets
Purity: 99.99%, Size: 4”, Thickness: 0.250”, Beige to White
Sputtering is an established method used to deposit thin films from a wide range of materials onto substrates of various shapes and sizes.
The sputtering process is repeatable and can be scaled from small research and development work to larger production batches involving medium to large substrate areas. Depending on the process parameters, chemical reactions may occur on the target surface, during material transport, or on the substrate. While sputter deposition involves many variables and is complex, it provides experts with a high level of control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. This process forms thin films by sputtering, which involves eroding material from a “target” and depositing it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are also used for etching applications. Sputter etching is preferred when a high degree of etching anisotropy is required and selectivity is less critical.
Sputtering targets are further used in analytical techniques that involve removing material from the target surface.
One example is secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As material is removed, the identity and concentration of emitted atoms are measured using mass spectrometry. With the help of the sputtering target, the composition of the material can be analyzed, allowing even extremely low impurity levels to be detected.
Sputtering targets also have applications in space research. Sputtering contributes to space weathering, a process that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
