Titanium Dioxide (TiO₂) Sputtering Targets
Purity: 99.9%, Size: 6”, Thickness: 0.250”, Grey to Black
Sputtering is a proven method for depositing thin films from a wide variety of materials onto different substrate shapes and sizes.
The process using sputter targets is repeatable and can be scaled from small research and development projects to larger production batches involving medium to large substrate areas. Depending on the process parameters, chemical reactions may occur on the target surface, in-flight, or on the substrate. While sputter deposition involves many variables and is a complex process, it provides experts with significant control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. This method deposits thin films by sputtering, which removes material from a “target” and transfers it onto a “substrate” such as a silicon wafer.
Semiconductor sputtering targets are used for etching. Sputter etching is preferred when a high degree of etching anisotropy is required and selectivity is not a major factor.
Sputter targets are also used for analytical applications by removing material from the target surface.
One example is secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As sputtering proceeds, the identity and concentration of sputtered atoms are measured using mass spectrometry. With the help of a sputtering target, the composition of the material can be identified, and even very low impurity levels can be detected.
Sputtering targets also have applications in space science. Sputtering is one of the processes involved in space weathering, which alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
