Titanium Dioxide (TiO₂) Sputtering Targets
Purity: 99.9%, Size: 4”, Thickness: 0.250”, Grey to Black
Sputtering is a proven method used to deposit thin films from a wide range of materials onto substrates of various shapes and sizes.
The sputtering process is repeatable and can be scaled from small research projects to larger production batches involving medium to large substrate areas. Depending on specific process parameters, chemical reactions may occur on the target surface, in-flight, or on the substrate. Although sputter deposition involves many variables and is complex, it offers experts a high level of control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. This method forms thin films by sputtering, a process that erodes material from a “target” and deposits it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are also used for etching. Sputter etching is preferred when a high degree of etching anisotropy is required and selectivity is less critical.
Sputtering targets are additionally used in analytical applications that involve etching material from the target surface.
An example is secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. During sputtering, the identity and concentration of emitted atoms are measured using mass spectrometry. With the support of the sputtering target, material composition can be identified, and even very low impurity levels can be detected.
Sputtering targets also have applications in space-related studies. Sputtering contributes to space weathering, a process that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
