Titanium Dioxide (TiO₂) Sputtering Targets
Purity: 99.9%, Size: 3”, Thickness: 0.250”, Grey to Black
Sputtering is a proven method for depositing thin films from a wide range of materials onto substrates of various shapes and sizes.
The process with sputter targets is repeatable and scalable, from small research and development projects to production batches involving medium to large substrate areas. Depending on process parameters, chemical reactions may occur on the target surface, during transport, or on the substrate. While sputter deposition involves multiple variables, it allows experts precise control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. This deposition method involves eroding material from a “target” and transferring it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching when a high degree of anisotropy is required and selectivity is not a concern.
Sputtering targets are also used for analytical purposes, by removing material from the target.
An example is secondary ion spectroscopy (SIMS), where the target is sputtered at a constant rate. During sputtering, the concentration and identity of atoms are measured via mass spectrometry. Sputtering targets enable determination of material composition, including extremely low concentrations of impurities.
Sputtering targets also have applications in space. Sputtering contributes to space weathering, a process that alters the physical and chemical properties of airless bodies, such as asteroids and the Moon.
