Titanium Carbide (TiC) Sputtering Targets
Purity: 99.5%, Size: 3”, Thickness: 0.125”
Sputtering is a proven technology capable of depositing thin films from a wide variety of materials onto substrates of diverse shapes and sizes. The process using sputter targets is repeatable and can be scaled up from small research and development projects. The process with sputter targets can also be adapted to production batches involving medium to large substrate areas. Chemical reactions may occur on the target surface, in-flight, or on the substrate depending on the process parameters. Although the many variables involved make sputter deposition a complex process, they also provide experts with substantial control over the growth and microstructure of the film.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. The deposition produced by sputter targets is a method of creating thin films through sputtering, which involves eroding material from a “target” source onto a “substrate” such as a silicon wafer.
Semiconductor sputtering targets are used to etch the target. Sputter etching is selected when a high degree of etching anisotropy is required and selectivity is not a primary concern.
Sputter targets are also used for analysis by etching away the target material.
One example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As sputtering continues, the concentration and identity of sputtered atoms are measured using mass spectrometry. With the aid of the sputtering target, the composition of the material can be determined, and even extremely low concentrations of impurities can be detected.
Sputtering targets also have applications in space. Sputtering is one of the processes associated with space weathering, which alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
