Tin (Sn) Sputtering Targets
Purity: 99.99%, Size: 1”, Thickness: 0.125”
Sputtering is a proven technology capable of depositing thin films from a wide variety of materials onto diverse substrate shapes and sizes. The process with sputter targets is repeatable and can be scaled up from small research and development projects. The process with sputter targets can be adapted to production batches involving medium to large substrate areas. The chemical reaction may occur on the target surface, in-flight, or on the substrate depending on the process parameters. These multiple parameters make sputter deposition a complex process but allow experts a high degree of control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering that involves eroding material from a “target” source onto a “substrate” such as a silicon wafer.
Semiconductor sputtering targets are used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy is needed and selectivity is not a concern.
Sputter targets are also used for analysis by etching away the target material.
One example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. By using the sputtering target, the composition of the target material can be determined, and even extremely low concentrations of impurities can be detected.
Sputtering targets also have applications in space. Sputtering is one of the forms of space weathering, a process that changes the physical and chemical properties of airless bodies, such as asteroids and the Moon.
