Silicon (Si) Sputtering Targets, P-type
Purity: 99.999%, Size: 2”, Thickness: 0.250”
Sputtering is a proven technology capable of depositing thin films from a wide range of materials onto substrates of various shapes and sizes.
The process using sputter targets is repeatable and scalable, making it suitable for small research and development projects as well as
production batches involving medium to large substrate areas. Depending on the process parameters, chemical reactions may occur on the target
surface, in-flight, or on the substrate itself. While sputter deposition involves numerous variables, this complexity enables experts to
maintain precise control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition through a process in which material is eroded from a “target” and deposited onto a “substrate,”
such as a silicon wafer.
Semiconductor sputtering targets are also used for etching applications where a high degree of etching anisotropy is needed and selectivity is
not a primary concern.
Additionally, sputter targets are used for analytical purposes that require controlled removal of target material.
One example is secondary ion mass spectrometry (SIMS), where the target sample is sputtered at a constant rate. As the material is removed, the
identity and concentration of sputtered atoms are analyzed using mass spectrometry. Through the use of sputtering targets, the composition of
a sample can be accurately determined, allowing detection of even extremely low impurity concentrations.
Sputtering targets also find application in space science. Sputtering is one of the mechanisms involved in space weathering, a process that
alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
