Silicon (Si) Sputtering Targets, P-type
Purity: 99.999%, Size: 1”, Thickness: 0.250”
Sputtering is a proven technology capable of depositing thin films from a wide range of materials onto substrates of various shapes and sizes.
The process using sputter targets is highly repeatable and can be scaled from small research and development projects to production batches
involving medium to large substrate areas. Depending on the process parameters, chemical reactions may occur on the target surface, in-flight,
or on the substrate. Although sputter deposition involves numerous variables, this complexity provides experts with significant control over
film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. This method deposits thin films by sputtering, which erodes material from a “target” and transfers it
onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are also used for etching when a high degree of etching anisotropy is required and selectivity is not a key concern.
Sputter targets are further utilized in analytical applications that involve gradually etching away the target material.
One example occurs in secondary ion spectroscopy (SIMS), where the sample is sputtered at a constant rate. As the target is eroded, the concentration
and identity of sputtered atoms are measured using mass spectrometry. With the aid of the sputtering target, the composition of the material can be
determined, allowing detection of even extremely low impurity concentrations.
Sputtering targets also have applications in space. Sputtering is one of the mechanisms contributing to space weathering, a process that alters the
physical and chemical properties of airless bodies such as asteroids and the Moon.
