Silicon (Si) Sputtering Targets, N-type
Purity: 99.999%, Size: 8”, Thickness: 0.250”
Sputtering is a proven technique used to deposit thin films from a wide range of materials onto substrates of various shapes and sizes. The process is highly repeatable and can be scaled from small research and development operations to medium- and large-scale production batches. Depending on the selected process parameters, chemical reactions may occur on the target surface, during particle travel, or directly on the substrate. While sputter deposition involves many variables, its complexity allows experts to maintain precise control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for thin-film deposition, a process that erodes material from a “target” source and deposits it onto a “substrate,” such as a silicon wafer.
In semiconductor processing, sputtering targets are also used for etching applications, particularly where a high degree of etching anisotropy is required and selectivity is not a primary concern.
Additionally, sputter targets are used in analytical methods that involve controlled removal of surface material.
A notable example is secondary ion mass spectroscopy (SIMS). In this technique, the sample is sputtered at a constant rate, and the sputtered atoms are analyzed with mass spectrometry. With the assistance of the sputtering target, the material composition can be determined with high precision, enabling detection of even extremely low impurity concentrations.
Sputtering targets also have applications in space science. Sputtering is one of the major processes involved in space weathering, which alters the physical and chemical properties of airless celestial bodies such as asteroids and the Moon.
