Silicon (Si) Sputtering Targets, N-type
Purity: 99.999%, Size: 8”, Thickness: 0.125”
Sputtering is a reliable and widely used technique for depositing thin films from numerous materials onto substrates of various shapes and sizes. The process is highly repeatable and can be scaled from small research and development environments to medium- and large-scale production. Depending on the processing conditions, chemical reactions may occur on the target surface, during particle travel, or directly on the substrate. Although sputter deposition involves many adjustable parameters, this complexity enables experts to achieve precise control over film growth and microstructural properties.
Applications of Sputtering Targets;
Sputtering targets are used for thin-film deposition, a process in which material is eroded from a “target” and deposited onto a “substrate,” such as a silicon wafer.
In semiconductor fabrication, sputtering targets are also employed for etching applications where a high degree of anisotropy is required and selectivity is not the primary concern.
Sputtering targets play an important role in analytical techniques as well.
A key example is secondary ion mass spectroscopy (SIMS), where the sample surface is sputtered at a controlled rate while the ejected atoms are analyzed by mass spectrometry. This allows precise identification of material composition and detection of extremely low impurity levels.
Sputtering also has relevance in space science. It is a fundamental process involved in space weathering, which alters the physical and chemical characteristics of airless celestial bodies such as the Moon and asteroids.
