Permalloy (Ni-Fe-Mo) Sputtering Targets
Size: 2”, Thickness: 0.125”
Sputtering is a proven technology capable of depositing thin films from a wide range of materials onto substrates of various shapes and sizes.
The sputtering process is repeatable and can be scaled from small research and development projects to larger production environments.
The process using sputter targets can be adapted for production batches involving medium to large substrate areas. Chemical reactions may occur on the target surface, in-flight, or on the substrate depending on the process parameters.
Although sputter deposition involves many variables that make it a complex process, these parameters allow experts to maintain a high level of control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets is used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering that involves eroding material from a “target” source onto a “substrate” such as a silicon wafer.
Semiconductor sputtering targets is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy is needed and selectivity is not a concern.
Sputter targets is also used for analysis by etching away the target material.
One of the example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. By helping of the sputtering target, the composition of the target material can be determined and even extremely low concentrations of impurities are detected.
Sputtering target has also application area in space. Sputtering is one of the forms of space weathering, a process that changes the physical and chemical properties of airless bodies, such as asteroids and the Moon.
