Nickel Chromium (Ni-Cr) Sputtering Targets
Purity: 99.95%, Size: 3”, Thickness: 0.250”
Sputtering is a well-established technology for depositing thin films from a wide range of materials onto diverse substrate shapes and sizes. The process using sputter targets is highly repeatable and can be scaled from small research and development projects to larger production batches. Sputtering targets can be adapted for medium to large substrate areas. The chemical reaction can occur on the target surface, in-flight, or on the substrate depending on process parameters. The numerous parameters make sputter deposition a complex process, yet provide experts with substantial control over the growth and microstructure of the deposited area.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. The deposition performed with sputter targets involves eroding material from a “target” source onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching. Sputter etching is selected when a high degree of etching anisotropy is required and selectivity is not a concern.
Sputter targets are also utilized for analysis by etching away the target material.
One example is in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. With the aid of the sputtering target, the composition of the target material can be determined, and even extremely low concentrations of impurities can be detected.
Sputtering targets also have applications in space. Sputtering is one form of space weathering, a process that alters the physical and chemical properties of airless bodies, such as asteroids and the Moon.
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