Nickel Chromium (Ni-Cr) Sputtering Targets
Purity: 99.95%, Size: 3”, Thickness: 0.125”
Sputtering is a well-established technology capable of depositing thin films from a wide variety of materials onto substrates of diverse shapes and sizes.
The process using sputter targets is repeatable and can be scaled from small research and development projects to larger production batches. The process with sputter targets can be adapted for medium to large substrate areas. Chemical reactions may occur on the target surface, in-flight, or on the substrate, depending on the process parameters. While the numerous parameters make sputter deposition complex, they also provide experts with a high degree of control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. Deposition with sputter targets involves eroding material from a “target” source onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching the target. Sputter etching is employed when a high degree of etching anisotropy is required and selectivity is not a primary concern.
Sputter targets are also used for analytical purposes by etching away the target material.
One example is secondary ion mass spectrometry (SIMS), where the target sample is sputtered at a constant rate. As the target is eroded, the concentration and identity of the sputtered atoms are measured using mass spectrometry. Using sputtering targets in this way allows the composition of the material to be determined, including the detection of extremely low concentrations of impurities.
Sputtering targets also have applications in space. Sputtering is one form of space weathering, a process that alters the physical and chemical properties of airless bodies, such as asteroids and the Moon.
