Nickel Chromium (Ni-Cr) Sputtering Targets
Purity: 99.9%, Size: 3”, Thickness: 0.125”
Sputtering is a proven technology capable of depositing thin films from a wide variety of materials onto substrates of diverse shapes and sizes.
The process with sputter targets is repeatable and can be scaled from small research and development projects. The process with sputter targets can also be adapted for production batches involving medium to large substrate areas. Chemical reactions can occur on the target surface, in-flight, or on the substrate depending on process parameters. While the numerous parameters make sputter deposition complex, they provide experts with significant control over the growth and microstructure of the films.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. Deposition with sputter targets involves eroding material from a “target” source onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used to etch the target. Sputter etching is selected in cases where a high degree of etching anisotropy is required and selectivity is not a concern.
Sputter targets are also used for analysis by etching away the target material.
One example occurs in secondary ion mass spectrometry (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using mass spectrometry. Using sputtering targets in this way allows the composition of the material to be determined, and even extremely low concentrations of impurities can be detected.
Sputtering targets also have applications in space. Sputtering is one form of space weathering, a process that alters the physical and chemical properties of airless bodies, such as asteroids and the Moon.
