Nickel Chromium (Ni-Cr) Sputtering Targets
Purity: 99.9%, Size: 2”, Thickness: 0.250”
Sputtering is a proven technology capable of depositing thin films from a wide variety of materials onto substrates of diverse shapes and sizes.
The process with sputter targets is repeatable and can be scaled up from small research and development projects. The process with sputter targets can also be adapted for production batches involving medium to large substrate areas. Chemical reactions may occur on the target surface, in-flight, or on the substrate depending on the process parameters. Although the numerous parameters make sputter deposition a complex process, they provide experts with substantial control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. Deposition with sputter targets is a method of creating thin films by sputtering, which involves eroding material from a “target” source onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used to etch the target. Sputter etching is chosen in applications requiring a high degree of etching anisotropy where selectivity is not a primary concern.
Sputter targets are also used for analytical purposes by etching away the target material.
One example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is eroded, the concentration and identity of the sputtered atoms are measured using mass spectrometry. With the aid of the sputtering target, the composition of the material can be determined, and even extremely low concentrations of impurities can be detected.
Sputtering targets also have application areas in space. Sputtering is one of the forms of space weathering, a process that alters the physical and chemical properties of airless bodies, such as asteroids and the Moon.
