Molybdenum (Mo) Sputtering Targets
Purity: 99.95%, Size: 6”, Thickness: 0.250”
Sputtering is a proven technique used to deposit thin films from a wide range of materials onto substrates of various shapes and sizes. The sputtering process is highly repeatable and can be scaled from small research and development projects to production batches involving medium to large substrate areas. Chemical reactions may occur on the target surface, during particle travel, or on the substrate, depending on the selected process parameters. Although sputter deposition involves many variables, this complexity provides experts with extensive control over the film’s growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for film deposition. Thin films are deposited by sputtering, a process that removes material from a “target” and transfers it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching the target. Sputter etching is selected when a high degree of etching anisotropy is required and selectivity is not critical.
Sputtering targets are also used for analytical applications by removing target material through etching.
One example is secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As sputtering occurs, the concentration and identity of ejected atoms are measured using mass spectrometry. Through this method, the composition of the target material can be determined, and even extremely low impurity concentrations can be detected.
Sputtering targets also have applications in space. Sputtering is one of the mechanisms involved in space weathering, a process that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
