Molybdenum (Mo) Sputtering Targets
Purity: 99.95%, Size: 4”, Thickness: 0.250”
Sputtering is a proven technology used to deposit thin films from a wide range of materials onto substrates of various shapes and sizes. The sputtering process is highly repeatable and can be scaled from small research and development projects to production batches involving medium to large substrate areas. Chemical reactions may occur on the target surface, during particle travel, or on the substrate depending on the process parameters. Although sputter deposition involves many variables, this complexity provides experts with a high degree of control over the growth and microstructure of the film.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. Thin films are deposited through sputtering, a method that removes material from a “target” and transfers it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used to etch the target. Sputter etching is selected when a high degree of etching anisotropy is required and selectivity is not a concern.
Sputtering targets are also used for analysis by etching away target material.
One example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As sputtering takes place, the concentration and identity of ejected atoms are measured using mass spectrometry. With the aid of the sputtering target, the composition of the target material can be determined, and even extremely low impurity concentrations can be detected.
Sputtering targets also have applications in space. Sputtering is one of the processes involved in space weathering, which alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
