Molybdenum Disulfide (MoS2) Sputtering Targets
Purity: 99.9%, Size: 6”, Thickness: 0.250”
Sputtering is a reliable technology for depositing thin films from a variety of materials onto substrates of different shapes and sizes.
The process with sputter targets is consistent and scalable, suitable for both small research projects and medium-to-large production batches.
Chemical reactions can occur on the target surface, in-flight, or on the substrate depending on the process parameters.
While sputter deposition involves many variables, this complexity allows experts precise control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are primarily used for thin-film deposition, where material is eroded from a “target” and deposited onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching when high anisotropy is required and selectivity is less critical.
Sputter targets also facilitate analysis by gradually removing material from the target surface.
For example, in secondary ion mass spectrometry (SIMS), the target sample is sputtered at a constant rate. The concentration and identity of sputtered atoms are measured, allowing determination of the target material’s composition, even detecting extremely low concentrations of impurities.
Sputtering targets also have space applications. Sputtering contributes to space weathering, a process that alters the physical and chemical properties of airless bodies like asteroids and the Moon.
