Molybdenum Disulfide (MoS2) Sputtering Targets
Purity: 99.9%, Size: 6”, Thickness: 0.125”
Sputtering is a proven technology for depositing thin films from a wide variety of materials onto substrates of different shapes and sizes.
The process using sputter targets is consistent and scalable, suitable for both small R&D projects and medium-to-large production batches.
Chemical reactions can occur on the target surface, in-flight, or on the substrate depending on the process parameters.
Though sputter deposition involves many variables, this complexity provides experts with precise control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are mainly used for thin-film deposition, where material is eroded from a “target” and deposited onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching when a high degree of anisotropy is required and selectivity is less critical.
Sputter targets are also used for material analysis by etching away the target surface.
For example, in secondary ion mass spectrometry (SIMS), the target sample is sputtered at a constant rate. The concentration and identity of sputtered atoms are measured, allowing determination of the target material’s composition, even detecting extremely low concentrations of impurities.
Sputtering targets also have space applications. Sputtering is one form of space weathering, a process that alters the physical and chemical properties of airless bodies, such as asteroids and the Moon.
