Molybdenum Disulfide (MoS2) Sputtering Targets
Purity: 99.9%, Size: 4”, Thickness: 0.250”
Sputtering is a well-established technique used to deposit thin films from a wide range of materials onto various substrate shapes and sizes.
The sputtering process is highly repeatable and can be scaled from small research and development applications to larger production environments.
Sputter targets can be tailored for production batches involving medium to large substrate areas. Depending on the process parameters, the chemical reaction may occur on the target surface, during particle flight, or on the substrate. Although sputter deposition involves many variables that make the process complex, these same parameters provide experts with exceptional control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for film deposition. Thin film formation through sputtering involves eroding material from a “target” and depositing it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are also used for etching applications. Sputter etching is preferred when a high degree of anisotropy is required and selectivity is not the primary concern.
Sputter targets additionally serve analytical purposes by enabling controlled material removal.
One example is secondary ion mass spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As sputtering progresses, the concentration and identity of ejected atoms are analyzed through mass spectrometry. Using sputtering targets, the composition of the material can be accurately determined, even revealing extremely low concentrations of impurities.
Sputtering targets also have applications in space environments. Sputtering is a form of space weathering that alters the physical and chemical properties of airless bodies, such as asteroids and the Moon.
