Molybdenum Disulfide (MoS₂) Sputtering Targets
Purity: 99.9%, Size: 3”, Thickness: 0.125”
Sputtering is a proven technology used to deposit thin films from a wide variety of materials onto substrates of different shapes and sizes.
The sputtering process is repeatable and can be scaled from small research and development projects to larger production batches.
Sputter targets can be adapted for medium to large substrate areas, and depending on the process parameters, chemical reactions may occur on the target surface, during particle flight, or on the substrate.
Although many parameters influence sputter deposition—making it a complex process—these same variables provide experts with significant control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for film deposition. Thin films are formed by sputtering, a method in which material is eroded from a “target” and deposited onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are also used for etching applications. Sputter etching is selected when a high degree of anisotropy is required and selectivity is not a critical factor.
Sputter targets are further used for analytical purposes that require controlled material removal.
One example is secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As sputtering occurs, the concentration and identity of ejected atoms are measured using mass spectrometry. This process enables determination of the target material’s composition and detection of extremely low impurity levels.
Sputtering targets also have applications in space. Sputtering contributes to space weathering, a process that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
