Molybdenum Disulfide (MoS2) Sputtering Targets
Purity: 99.9%, Size: 2”, Thickness: 0.125”
Sputtering is a proven technology used to deposit thin films from a wide range of materials onto substrates of various shapes and sizes.
The process involving sputter targets is repeatable and can be scaled from small research and development projects to larger production batches.
This method can be adapted for medium to large substrate areas. Chemical reactions may occur on the target surface, during particle flight,
or directly on the substrate depending on the process parameters. Although sputter deposition involves many variables and is therefore complex,
it provides experts with extensive control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. The deposition performed with sputter targets is a method of creating thin films by sputtering,
which involves eroding material from a “target” source onto a “substrate” such as a silicon wafer.
Semiconductor sputtering targets are used to etch the target. Sputter etching is selected in cases requiring a high degree of etching anisotropy
where selectivity is not a major concern.
Sputter targets are also used for analytical purposes by etching away the target material.
One example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered,
the concentration and identity of released atoms are measured using mass spectrometry. With the assistance of the sputtering target,
the composition of the target material can be determined, and even extremely low impurity concentrations can be detected.
Sputtering targets also have applications in space. Sputtering is one of the forms of space weathering, a process that alters the physical and
chemical properties of airless bodies such as the Moon and asteroids.
