Molybdenum Disulfide (MoS2) Sputtering Targets
Purity: 99.9%, Size: 1”, Thickness: 0.250”
Sputtering is a proven technique used to deposit thin films from a wide range of materials onto substrates of various shapes and sizes.
The process using sputter targets is repeatable and can be scaled from small research and development projects to larger production needs involving medium to large substrate areas. Chemical reactions may occur on the target surface, during particle flight, or on the substrate, depending on the selected process parameters. These numerous parameters make sputter deposition a complex process, yet they allow experts substantial control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for thin-film deposition. This method involves eroding material from a “target” and depositing it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are also used for etching applications. Sputter etching is preferred when high anisotropy is required and selectivity is not critical.
Sputtering targets are additionally utilized for analytical purposes by gradually removing material from the target surface.
One example is secondary ion mass spectroscopy (SIMS), where the target sample is sputtered at a controlled rate. As material is removed, the concentration and identity of the sputtered atoms are analyzed using mass spectrometry. Through sputtering, the composition of the target can be determined, and even extremely low impurity levels can be detected.
Sputtering targets also have applications in space-related fields. Sputtering is one form of space weathering, a process that alters the physical and chemical characteristics of airless bodies such as asteroids and the Moon.
