Molybdenum Disulfide (MoS₂) Sputtering Targets
Purity: 99.9%, Size: 1”, Thickness: 0.125”
Sputtering is a proven technology used to deposit thin films from a wide variety of materials onto substrates of different shapes and sizes.
The process using sputter targets is repeatable and can be scaled from small research and development projects to larger production batches involving medium to large substrate areas. Chemical reactions may occur on the target surface, during particle flight, or directly on the substrate, depending on the selected process parameters. Although sputter deposition is complex due to its many variables, it provides experts with substantial control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for thin-film deposition. This method deposits thin films by sputtering, which involves eroding material from a “target” and transferring it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching purposes. Sputter etching is preferred when a high degree of anisotropy is required and selectivity is not a priority.
Sputtering targets are also used in analytical applications by gradually removing target material.
One example is secondary ion mass spectroscopy (SIMS), where the target sample is sputtered at a controlled rate. As sputtering progresses, the concentration and identity of emitted atoms are analyzed using mass spectrometry. With the help of the sputtering target, the composition of the material can be determined, and even extremely low impurity levels can be detected.
Sputtering targets also find use in space-related applications. Sputtering is a form of space weathering, a process that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
