Molybdenum Disulfide (MoS2) Sputtering Targets, indium
Purity: 99.9%, Size: 3”, Thickness: 0.125”
Sputtering is a proven technology used to deposit thin films from a wide variety of materials onto substrates of diverse shapes and sizes.
The process with sputter targets is consistent and scalable, suitable for small research projects as well as medium and large production batches.
Chemical reactions may occur on the target surface, during particle flight, or on the substrate, depending on process parameters.
Although sputter deposition involves many variables, this complexity allows experts to exercise precise control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for thin-film deposition, a method in which material is eroded from a “target” and deposited onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching when a high degree of anisotropy is required and selectivity is not critical.
Sputter targets are also employed in analytical applications by gradually removing material from the target surface.
One example is secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As sputtering progresses, the concentration and identity of the ejected atoms are measured using mass spectrometry. With the help of the sputtering target, the composition of the material can be determined, including extremely low concentrations of impurities.
Sputtering targets also have applications in space. Sputtering is one form of space weathering—a process that modifies the physical and chemical properties of airless bodies such as asteroids and the Moon.
