Molybdenum Disilicide (MoSi₂) Sputtering Targets
Purity: 99.95%, Size: 3”, Thickness: 0.250”
Sputtering is a proven technology capable of depositing thin films from a wide variety of materials onto substrates of diverse shapes and sizes.
The process using sputter targets is repeatable and can be scaled up from small research and development projects to production batches involving medium to large substrate areas. Chemical reactions may occur on the target surface, in-flight, or on the substrate depending on the process parameters. The many variables make sputter deposition a complex process, yet they provide experts with substantial control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for film deposition. Thin films are deposited by sputtering, a method that erodes material from a “target” source and transfers it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used to etch the target. Sputter etching is preferred when a high degree of etching anisotropy is required and selectivity is not a concern.
Sputtering targets are also used for analytical purposes by gradually removing target material.
One example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of the removed atoms are measured using mass spectrometry. Through this process, the composition of the target material can be determined, and even extremely low impurity concentrations can be detected.
Sputtering targets also have applications in space-related fields. Sputtering is one form of space weathering, a process that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
