Molybdenum Disilicide (MoSi2) Sputtering Targets
Purity: 99.95%, Size: 2”, Thickness: 0.125”
Sputtering is a well-established technology used to deposit thin films from a broad range of materials onto various substrate shapes and sizes.
The sputtering process is repeatable and can be scaled from small research and development projects to larger production batches. It can also be adapted for medium to large substrate areas. Depending on process parameters, chemical reactions may occur on the target surface, in-flight, or directly on the substrate. Although sputter deposition involves many variables and is a complex process, these parameters give experts significant control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for film deposition. Thin film deposition via sputtering involves eroding material from a “target” and transferring it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching when a high degree of anisotropy is required and selectivity is not critical.
Sputtering targets are also used in analytical applications by etching away target material.
One example is secondary ion mass spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As sputtering progresses, the concentration and identity of the emitted atoms are analyzed using mass spectrometry. With the aid of the sputtering target, the composition of the material can be determined, and even extremely low impurity concentrations can be detected.
Sputtering targets also have applications in space. Sputtering contributes to space weathering, a process that alters the physical and chemical properties of airless bodies such as the Moon and asteroids.
