Molybdenum Disilicide (MoSi2) Sputtering Targets
Purity: 99.95%, Size: 1”, Thickness: 0.125”
Sputtering is a well-established technique capable of depositing thin films from a wide range of materials onto substrates of various shapes and sizes.
The process using sputter targets is highly repeatable and can be scaled from small research and development projects to larger production environments.
Sputter targets can be adapted for production batches involving medium to large substrate areas. Chemical reactions may occur on the target surface,
during particle flight, or directly on the substrate, depending on process parameters. Although sputter deposition is complex due to the many variables
involved, this complexity provides experts with significant control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for film deposition. The deposition performed using sputter targets is a method of creating thin films by sputtering,
which involves eroding material from a “target” and depositing it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching the target. Sputter etching is selected when a high degree of etching anisotropy is required
and selectivity is not a critical factor.
Sputter targets are also used for analytical purposes by etching away the target material.
One example is secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is eroded, the concentration
and identity of sputtered atoms are measured using mass spectrometry. With the help of the sputtering target, the composition of the target material
can be determined, and even extremely low impurity concentrations can be detected.
Sputtering targets also have applications in space. Sputtering is one form of space weathering—a process that alters the physical and chemical
properties of airless bodies such as asteroids and the Moon.
