Manganese (Mn) Sputtering Targets
Purity: 99.95%, Size: 1”, Thickness: 0.250”
Sputtering is a proven technology capable of depositing thin films from a wide range of materials onto substrates of various shapes and sizes. The sputtering process is highly repeatable and can be scaled from small research and development projects to medium- and large-scale production batches. Sputter targets can be adapted to different production needs, with chemical reactions occurring on the target surface, in-flight, or directly on the substrate depending on the process parameters. Although sputter deposition involves many variables and can be complex, these parameters provide experts with extensive control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. This method deposits thin films by eroding material from a “target” source and transferring it onto a “substrate” such as a silicon wafer. Semiconductor sputtering targets are also used for etching, particularly in situations requiring a high degree of etching anisotropy where selectivity is not a major concern.
Sputter targets are further utilized for analytical applications through controlled material removal. One example is secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. During this process, the concentration and identity of sputtered atoms are analyzed using mass spectrometry. With the aid of the sputtering target, the composition of the material can be accurately determined, allowing even extremely low levels of impurities to be detected.
Sputtering targets also have applications in space-related fields. Sputtering is one form of space weathering, a process that alters the physical and chemical properties of airless celestial bodies, such as asteroids and the Moon.
