Manganese (Mn) Sputtering Targets
Purity: 99.9%, Size: 2”, Thickness: 0.250”
Sputtering is a proven technology used to deposit thin films from a wide variety of materials onto diverse substrate shapes and sizes. The process with sputter targets is repeatable and can be scaled from small research and development projects to larger production batches. Sputter targets can be adapted for batches involving medium to large substrate areas. Chemical reactions may occur on the target surface, in-flight, or on the substrate depending on the process parameters. The many adjustable parameters make sputter deposition a complex process, yet they allow experts substantial control over the growth and microstructure of the deposited layer.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. This method involves eroding material from a “target” source onto a “substrate” such as a silicon wafer. Semiconductor sputtering targets are used to etch the target, and sputter etching is selected in cases requiring a high degree of etching anisotropy where selectivity is not critical. Sputter targets are also used for analytical purposes by etching away the target material. One example is in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As sputtering occurs, the concentration and identity of sputtered atoms are measured using mass spectrometry. With the help of the sputtering target, the composition of the target material can be identified, and even extremely low concentrations of impurities can be detected.
Sputtering targets also have applications in space. Sputtering is a form of space weathering, a process that alters the physical and chemical properties of airless bodies, such as asteroids and the Moon.
