Magnesium Oxide (MgO) Sputtering Targets
Purity: 99.95%, Size: 1”, Thickness: 0.250”
Sputtering is a proven technology capable of depositing thin films from a wide variety of materials onto diverse substrate shapes and sizes.
The process using sputter targets is repeatable and can be scaled from small research and development projects to larger production batches. The process with sputter targets can be adapted for medium to large substrate areas. Chemical reactions may occur on the target surface, in-flight, or on the substrate depending on process parameters. While sputter deposition involves many variables, it allows experts significant control over the growth and microstructure of the deposited film.
Applications of Sputtering Targets
Sputtering targets are used for thin film deposition. This process involves eroding material from a “target” source onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are also used for etching. Sputter etching is preferred when high etching anisotropy is required, and selectivity is not critical.
Sputter targets are additionally used for material analysis. For example, in secondary ion mass spectrometry (SIMS), the target sample is sputtered at a constant rate, and the concentration and identity of the sputtered atoms are measured via mass spectrometry. Using this method, the composition of the target material can be determined, even detecting extremely low concentrations of impurities.
Sputtering targets also have applications in space. Sputtering is a form of space weathering that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
