Magnesium Oxide (MgO) Sputtering Targets, indium
Purity: 99.95%, Size: 3”, Thickness: 0.125”
Sputtering is a proven technology used to deposit thin films from a wide variety of materials onto diverse substrate shapes and sizes. The process using sputter targets is highly repeatable and can be scaled from small research and development projects to production batches involving medium to large substrate areas. Depending on the process parameters, chemical reactions may occur on the target surface, in-flight, or on the substrate. Although sputter deposition involves many variables and therefore complexity, this also allows experts to maintain a high degree of control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for film deposition. This method deposits thin films by eroding material from a “target” source and transferring it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching the target. Sputter etching is selected when a high degree of etching anisotropy is required and selectivity is not a primary concern.
Sputtering targets are also used for analytical purposes by incrementally etching away the target material. For example, in secondary ion spectroscopy (SIMS), the target sample is sputtered at a constant rate. As sputtering occurs, the concentration and identity of the sputtered atoms are measured using mass spectrometry. Through the use of a sputtering target, the composition of the material can be determined, and even extremely low impurity concentrations can be detected.
Sputtering targets also have applications in space-related processes. Sputtering is one of the mechanisms involved in space weathering, which alters the physical and chemical properties of airless celestial bodies such as asteroids and the Moon.
