Magnesium Oxide (MgO) Sputtering Targets, Indium
Purity: 99.95%, Size: 2”, Thickness: 0.125”
Sputtering is a well-established technology capable of depositing thin films from a wide range of materials onto diverse substrate shapes and sizes.
The process using sputter targets is repeatable and can be scaled from small research and development projects to larger production batches. The process with sputter targets can be adapted for substrates of medium to large areas. Chemical reactions may occur on the target surface, in-flight, or on the substrate depending on the process parameters. While sputter deposition involves many variables, it provides experts with significant control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are used for film deposition. Deposition via sputter targets is a method of creating thin films by sputtering material from a “target” source onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching the target. Sputter etching is selected in situations requiring a high degree of etching anisotropy where selectivity is not critical.
Sputter targets are also employed for analytical purposes by etching away the target material.
An example of this application occurs in secondary ion mass spectrometry (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of the ejected atoms are measured using mass spectrometry. Using the sputtering target, the composition of the material can be determined, and even extremely low concentrations of impurities can be detected.
Sputtering targets also have applications in space. Sputtering is a form of space weathering, a process that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
