Magnesium (Mg) Sputtering Targets
Purity: 99.98%, Size: 6”, Thickness: 0.250”
Magnesium (Mg) sputtering targets are ideal for depositing thin films from a wide range of materials onto substrates of diverse shapes and sizes. The sputtering process is repeatable and scalable, suitable for both small research projects and medium- to large-scale production batches. Depending on the process parameters, chemical reactions can occur on the target surface, in-flight, or directly on the substrate. Despite the complexity of sputter deposition, it provides precise control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for thin-film deposition, where material is eroded from a “target” and deposited onto a substrate such as a silicon wafer.
In semiconductor processes, sputter etching is used when high anisotropy is required and selectivity is not critical.
Targets are also employed for analytical purposes by gradually removing target material.
One example is secondary ion mass spectroscopy (SIMS), where the sample is sputtered at a constant rate and the emitted atoms are analyzed via mass spectrometry. This enables determination of material composition and detection of extremely low concentrations of impurities.
Sputtering also has space applications. It contributes to space weathering, a process that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
