Magnesium (Mg) Sputtering Targets
Purity: 99.98%, Size: 5”, Thickness: 0.125”
Magnesium (Mg) sputtering targets are ideal for depositing thin films from a wide range of materials onto substrates of various shapes and sizes. The sputtering process is repeatable and can be scaled from small research projects to medium- and large-scale production batches. Depending on the process parameters, chemical reactions may occur on the target surface, in-flight, or directly on the substrate. While sputter deposition is complex, it allows precise control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for thin-film deposition, where material is eroded from a “target” and deposited onto a substrate such as a silicon wafer.
In semiconductor manufacturing, sputter etching is applied when high anisotropy is required and selectivity is not critical.
Targets are also used for analytical purposes by gradually removing target material.
One example is secondary ion mass spectroscopy (SIMS), where the sample is sputtered at a constant rate and the ejected atoms are analyzed via mass spectrometry. This allows determination of material composition and detection of extremely low concentrations of impurities.
Sputtering has applications in space as well. It contributes to space weathering—a process that modifies the physical and chemical properties of airless bodies such as asteroids and the Moon.
